Analysis of residual thermal stress in CVD-W coating as plasma facing material

Chemical vapor deposition-tungsten (CVD-W) coating covering the surface of the plasma facing component (PFC) is an effective method to implement the tungsten material as plasma facing material (PFM) in fusion devices. Residual thermal stress in CVD-W coating due to thermal mismatch between coating and substrate was successfully simulated by using a finite element method (ANSYS 10.0 code). The deposition parametric effects, i.e., coating thickness and deposition temperature, and interlayer were investigated to get a description of the residual thermal stress in the CVD-W coating-substrate system. And the influence of the substrate materials on the generation of residual thermal stress in the CVD-W coating was analyzed with respect to the CVD-W coating application as PFM. This analysis is beneficial for the preparation and application of CVD-W coating.