Discharge Simulation and Fabrication Process of an Aluminum Electrode and an Alumina Layer in AC-PDP

LIU Qifa (刘启发); DING Guifu (丁桂甫); YAN Qun (严群); LIU Chang (刘畅); WANG Yan (王艳)

doi:10.1088/1009-0630/15/4/11

Plasma Science and Technology > 2013 > 15(4): 368-375. > DOI: 10.1088/1009-0630/15/4/11

LIU Qifa (刘启发), DING Guifu (丁桂甫), YAN Qun (严群), LIU Chang (刘畅), WANG Yan (王艳). Discharge Simulation and Fabrication Process of an Aluminum Electrode and an Alumina Layer in AC-PDP[J]. Plasma Science and Technology, 2013, 15(4): 368-375. DOI: 10.1088/1009-0630/15/4/11

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Discharge Simulation and Fabrication Process of an Aluminum Electrode and an Alumina Layer in AC-PDP

1 National Key Laboratory of Science and Technology on Nano/Micro Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, Shanghai 200240, China 2 Sichuan Changhong Electric Co. Ltd., Mianyang 621000, China

Funds: supported by Research Fund for the Doctoral Program of Higher Education of China (20120073110061)

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Received Date: May 10, 2011

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Abstract

Abstract

A larger space PDP cell with patterned aluminum as the addressing electrode and alumina as the dielectric layer was proposed. The aluminum electrode and the alumina dielectric layer formed on the aluminum electrode were prepared separately by magnetron sputtering and anodic oxidation for plasma display panel. The properties of the aluminum electrode and the alumina dielectric layer were tested and can meet the demand of PDP application. The resistivity of the aluminum electrode is about 5x1^-8 Ω.m, the voltage withstanding of the alumina dielectric layer exceeds 100 V/μm and the relative permittivity is about 3.5 at 1 MHz. With this structure, the manufacturing cost of PDP could be cut and the addressing discharge formative delay is reduced by 0.67%, which is proved by PIC-MCC simulation.
- PDP,
- addressing discharge,
- formative delay,
- manufacturing cost,
- PIC-MCC

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