Citation: | ZHANG Jicheng (张继成), ZHOU Minjie (周民杰), WU Weidong (吴卫东), TANG Yongjian (唐永建). Fabrication of Diamond Microstructures by Using Dry and Wet Etching Methods[J]. Plasma Science and Technology, 2013, 15(6): 552-554. DOI: 10.1088/1009-0630/15/6/12 |
[1] | Gerhard FRANZ, Ralf MEYER, Markus-Christian AMANN. Correlation of III/V semiconductor etch results with physical parameters of high-density reactive plasmas excited by electron cyclotron resonance[J]. Plasma Science and Technology, 2017, 19(12): 125503. DOI: 10.1088/2058-6272/aa89e0 |
[2] | MIAO Chunguang (苗春光), WANG Xiangqin (王相勤). Mass Deposition, Etching and Sputtering Effects of Low-Energy N + Ion Irradiation on Solid Fly Ash[J]. Plasma Science and Technology, 2013, 15(12): 1232-1236. DOI: 10.1088/1009-0630/15/12/13 |
[3] | YU Binbin (于斌斌), YUAN Juntang (袁军堂), WANG Zhenhua (汪振华), HU Xiaoqiu (胡小秋). Research on the Mechanism of Multilayer Reactive Ion Etching[J]. Plasma Science and Technology, 2013, 15(8): 825-829. DOI: 10.1088/1009-0630/15/8/21 |
[4] | ZHANG Peng (张鹏), WANG Jun (王俊), SUN Yang (孙阳), DING Zejun (丁泽军). Charging Effect in Plasma Etching Mask of Hole Array[J]. Plasma Science and Technology, 2013, 15(6): 570-576. DOI: 10.1088/1009-0630/15/6/15 |
[5] | ZHENG Yanbin (郑艳彬), LI Guang (李光), WANG Wenlong (王文龙), LI Xiuchang (李秀昌), JIANG Zhigang(姜志刚). Dry Etching Characteristics of Amorphous Indium-Gallium-Zinc-Oxide Thin Films[J]. Plasma Science and Technology, 2012, 14(10): 915-918. DOI: 10.1088/1009-0630/14/10/11 |
[6] | ZHAO Chengli (赵成利), DENG Chaoyong (邓朝勇), SUN Weizhong(孙伟中), ZHANG Junyuan (张浚源), CHEN Feng (陈峰), HE Pingni (贺平逆), CHEN Xu (陈旭), GOU Fujun (芶富均). Etching Mechanisms of CF3 Etching Fluorinated Si: Molecular Dynamics Simulation[J]. Plasma Science and Technology, 2012, 14(7): 670-674. DOI: 10.1088/1009-0630/14/7/23 |
[7] | DAI Zhongling(戴忠玲), YUE Guang(岳光), WANG Younian(王友年). Simulations of Ion Behaviors in a Photoresist Trench During Plasma Etching Driven by a Radio-Frequency Source[J]. Plasma Science and Technology, 2012, 14(3): 240-244. DOI: 10.1088/1009-0630/14/3/10 |
[8] | WANG Qing (王庆), WANG Yongfu (王永富), BA Dechun (巴德纯), YUE Xiangji (岳向吉). The Effect of Ion Current Density on Target Etching in Radio Frequency-Magnetron Sputtering Process[J]. Plasma Science and Technology, 2012, 14(3): 235-239. DOI: 10.1088/1009-0630/14/3/09 |
[9] | LIU Xuelan (刘雪兰), XU An (许安), DAI Yin (戴银), YUAN Hang (袁航), YU Zengliang (余增亮). Surface Etching and DNA Damage Induced by Low-Energy Ion Irradiation in Yeast[J]. Plasma Science and Technology, 2011, 13(3): 381-384. |
[10] | M. RADMILOVIC-RADJENOVIC, B. RADJENOVIC. The Effects of Chemical (isotropic) and Anisotropic Etching Processes on the Roughening of Nanocomposite Substrates[J]. Plasma Science and Technology, 2010, 12(6): 673-676. |