Linear Plasma Sources for Large Area Film Deposition: A Brief Review

WEI Yu(魏钰); ZUO Xiao(左潇); CHEN Longwei(陈龙威); MENG Yuedong(孟月东); FANG Shidong(方世东); SHEN Jie(沈洁); SHU Xingsheng(舒兴胜)

doi:10.1088/1009-0630/16/4/10

Plasma Science and Technology > 2014 > 16(4): 356-362. > DOI: 10.1088/1009-0630/16/4/10

WEI Yu(魏钰), ZUO Xiao(左潇), CHEN Longwei(陈龙威), MENG Yuedong(孟月东), FANG Shidong(方世东), SHEN Jie(沈洁), SHU Xingsheng(舒兴胜). Linear Plasma Sources for Large Area Film Deposition: A Brief Review[J]. Plasma Science and Technology, 2014, 16(4): 356-362. DOI: 10.1088/1009-0630/16/4/10

Citation:

PDF (1104 KB)

Linear Plasma Sources for Large Area Film Deposition: A Brief Review

Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 230031, China

Funds: supported by National Natural Science Foundation of China (No. 11205201)

More Information

Received Date: July 17, 2012

Graphical Abstract

Abstract

Abstract

By utilization of different excitation power sources, linear plasma sources can be differentiated into DC, RF, VHF, microwave and dual frequency types. Through installing several linear plasma sources in parallel or adopting the so-called roll-to-roll (air-to-air) process, scale uniform linear plasma sources were realized and successfully applied to the deposition of large area uniform dielectric thin films. Furthermore, the magnetic field system can effectively reduce the recombination losses on the wall of the vacuum chamber and enhance the plasma density. Linear plasma sources with approximately one square meter deposition area with the plasma density of 10 ¹¹ cm⁻³ have been developed, some of which have been used for the deposition of dielectric layers and large area plasma etching.
- linear plasma sources,
- large area,
- uniform,
- high density

FullText(HTML)

References (72)

References

1 Holland J, Barnes M, Demos A, et al. 1996, SID Sym.Digest., 27: 526;

2 Heinrich F, Banzlger U, Jentzsch A, et al. 2000, J. Vac.Sci. Technol. B, 14: 2000;

3 Takei H, Kawamura H, Ohta Y, et al. 1998, SID Sym Digest., 98: 1102;

4 Schmitt J, Elyaakoubi M, Sansonnens L. 2002, Plasma Sources Sci. Technol., 11: 206;

5 Chen L W, Meng Y D, Shen J, et al. 2009, J. Phys. D:Appl. Phys., 42: 55505;

6 Schoenbach K H, Tessnow T, Peterkin F E, et al. 1996,Appl. Phys. Lett., 68: 3;

7 Xu S, Ostrikov K N, Li Y, et al. 2001, Phys. Plasmas,8: 2549;

8 Fang S D, Meng Y D, Shen J, et al. 2011, Plasma Sci.Technol., 13: 217;

9 Flikweert A J, Zimmermann T, Merdzhanova T, et al.2012, J. Phys. D: Appl. Phys., 45: 015101;

10 Tanjyo M, Sakai S, Takahashi M. 2001, Surf. Coat.Technol., 136: 281;

11 águas H, Silva V, Fortunato E, et al. 2003, Jpn. J.Appl. Phys., 42: 4935;

12 Taylor A, Fendrych F, Fekete L, et al. 2011, Diamond Relat. Mater., 20: 613;

13 Stephan U, Kuske J, Kottwitz A, et al. 1999, Mat. Res.Soc. Symp., 557: 157;

14 Niu J H, Liu D P, Wu Y F. 2011, Surf. Coat. Technol.,205: 3434;

15 Rank R, W?unsche T, Günther S. 2003, Surf. Coat.Technol., 174: 218;

16 Gweon G H, Lim J H, Kim K N, et al. 2010, Vacuum,84: 823;

17 Mao M, Bogaerts A. 2010, J. Phys. D: Appl. Phys.,43: 205201;

18 Shinohara S, Motomura1 T, Tanaka1 K, et al. 2010,Plasma Sources Sci. Technol., 19: 034018;

19 Fukasawa T, Fujii S, Shindo H. 2005, Jpn. J. Appl.Phys., 44: 1945;

20 Hubner S, Wolthuis J, Palomares J M, et al. 2011, J.Phys. D: Appl. Phys., 44: 385202;

21 Kim K N, Lim J H, Jeong H B, et al. 2012, Microelec-tron. Eng., 89: 133;

22 Aken B B V, Devilee C, D?orenk?amper M, et al. 2007,J. Non-Cryst. Solids, 354: 2392;

23 Zimmermann T, Strobel C, Albert M, et al. 2010,Phys. Status Solidi A, 7: 1097;

24 Schlemm H, Fritzsche M, Roth D. 2005, Surf. Coat.Technol., 200: 958;

25 Strobel C, Zimmermanna T, Albert M, et al. 2009, Sol.Energy Mater. Sol. Cells, 93: 1598;

26 Rudiger J, Brechtela H, Kottwitz A, et al. 2003, Thin Solid Films, 427: 16;

27 Kaiser M, Baumg?artner K M, Schulz A, et al. 1999,Surf. Coat. Technol., 119: 552;

28 Nagatsu M, Ito A, Toyodaet N, et al. 1999, Jpn. J.Appl. Phys., 38: 679;

29 Takagia T, Takechib K, Nakagawaa Y, et al. 1998, Vac-uum, 51: 751;

30 Murata1 M, Takeuchi1 Y, Sasagawa E, et al. 1996,Rev. Sci. Instrum., 67: 1542;

31 Takeuchiet Y, Nawata Y, Ogawa K, et al. 2001, Thin Solid Films, 386: 133;

32 Krzec D, Mildner M, Hillemannet F, et al. 1997, Surf.Coat. Technol., 97: 759;

33 Bluem E, Bechu S, Leprince P, et al. 1995, J. Phys. D:Appl. Phys., 28: 1529;

34 Setsuharaet Y. 2005, J. Plasma Fusion Res., 81: 85;

35 Setsuharaet Y, Shoji T, Ebe A, et al. 2003, Surf. Coat.Technol., 33: 174;

36 Wu Y, Lieberman M A. 1998, Appl. Phys. Lett., 72:777;

37 Lieberman M A, Booth J P, Chabert P, et al. 2002,Plasma Sources Sci. Technol., 11: 283;

38 Nagatsu M, Morita S, Ghanashevet I, et al. 2000, J.Phys. D: Appl. Phys., 33: 1143;

39 Zakrzewski Z, Moisan M. 1995, Plasma Sources Sci.Technol., 4: 379;

40 Pollak J, Moisan M, Zakrzewski Z, et al. 2007, Plasma Sources Sci. Technol., 16: 310;

41 Ono K. 2004, J. Plasma Fusion Res., 80: 909;

42 Tobari H. 2008, Rev. Sci. Instrum., 79: 111;

43 Hopfe B V, Rogler D, Maeder G, et al. 2005, Chem.Vap. Deposition, 11: 510;

44 Linaschke D, Leistner M, Grabau P, et al. 2009, IEEETrans. Plasma Sci., 37: 6;

45 Bárdo? L, Baránková H, Berg S. 1997, Appl. Phys.Lett., 70: 577;

46 Lan Y, You Q L, Cheng C, et al. 2011, Plasma Sci.Technol. 13: 88;

47 Yu Z, Shaw D, Gonzales P, et al. 1995, J. Vac. Sci.Technol. A, 13: 503;

48 Kim J H, Lee H J, Kim Y T, et al. 1997, J. Vac. Sci.Technol. A, 15: 564;

49 Meziani T, Colpo P, Rossi F. 2001, Plasma Sources Sci. Technol., 10: 276;

50 Suzuki K, Nakamura K, Ohkubo H, et al. 1998, Plasma Sources Sci. Technol., 7: 13;

51 Kanoh M, Suzuki K, Tonotani J, et al. 2001, Jpn. J.Appl. Phys., 40: 5419;

52 Kim K N, Jung S J, Lee Y J, et al. 2005, J. Appl.Phys., 97: 063302;

53 Lim J H, Kim K N, Park J K, et al. 2008, Appl. Phys.Lett., 92: 051504;

54 Kim K N, Lim J H, Park J K, et al. 2008, Surf. Coat.Technol., 202: 5242;

55 Kim K N, Jung S J, Yeom G Y. 2005, Thin Solid Films,491: 82;

56 Kim K N, Jung S J, Yeom G Y. 2005, Jpn. J. Appl.Phys., 44: 8133;

57 Lim J H, Kim K N, Yeom G Y. 2007, Plasma Process.Polym., 4: 999;

58 Jung S J, Kim K N, Yeom G Y. 2005, Surf. Coat.Technol., 200: 780;

59 Kim K N, Min K S, Yeom G Y. 2006, Jpn. J. Appl.Phys., 45: 8869;

60 Kim K N, Jung S J, Yeom G Y. 2005, Surf. Coat.Technol., 200: 784;

61 Kim K N, Yeom G Y. 2006, J. Korean Phys. Soc., 48:256;

62 Kim K N, Lim J H, Park J K, et al. 2008, Plasma Chem. Plasma Process., 28: 147;

63 Liehr M, Dieguez-Campo M. 2005, Surf. Coat. Tech-nol., 200: 21;

64 Neykova N, Kozaka H, Ledinsky M, et al. 2012, Vac-uum, 86: 603;

65 Liehr M, Wieder S, Dieguez-Campo M. 2006, Thin Solid Films, 502: 9;

66 R?auchle E. 1998, J. Phys. IV France, 8: 7;

67 Fendrych F, Taylor A, Peksa L, et al. 2010, J. Phys.D: Appl. Phys., 43: 374018;

68 Schlemm H, Mai A, Roth S, et al. 2003, Surf. Coat.Technol., 174: 208;

69 Madocks J, Rewhinkle J, Barton L. 2005, Mater. Sci.Eng. B, 119: 268;

70 Hong G D. 2004, J. Korean Phys. Soc., 44: 1000;

71 Intrator T, Menard J. 1996, Plasma Sources Sci. Tech-nol., 5: 371;

72 Kim K N, Lim J H, Yeom G Y, et al. 2006, Appl. Phys.Lett., 89: 251501

[1]	Zihan LI, Shangchuan YANG, Xinhang XU, Lifu ZHANG, Chengming QU, Chengpu LI, Ge ZHUANG, Jinlin XIE. A synthetic diagnostics platform for microwave imaging diagnostics in tokamaks[J]. Plasma Science and Technology, 2024, 26(3): 034006. DOI: 10.1088/2058-6272/ad0d4c
[2]	T HAPPEL, W KASPAREK, P HENNEQUIN, K HÖFLER, C HONORÉ, the ASDEX Upgrade Team. Design of a variable frequency comb reflectometer system for the ASDEX Upgrade tokamak[J]. Plasma Science and Technology, 2020, 22(6): 64002-064002. DOI: 10.1088/2058-6272/ab618c
[3]	Jianqiang HU (胡健强), Ahdi LIU (刘阿娣), Chu ZHOU (周楚), Xiaohui ZHANG (张小辉), Mingyuan WANG (王明远), Jin ZHANG (张津), Xi FENG (冯喜), Hong LI (李弘), Jinlin XIE (谢锦林), Wandong LIU (刘万东), Changxuan YU (俞昌旋). An accurate automated technique for quasi-optics measurement of the microwave diagnostics for fusion plasma[J]. Plasma Science and Technology, 2017, 19(8): 84002-084002. DOI: 10.1088/2058-6272/aa6794
[4]	GAO Yu (高宇), WANG Yumin (王嵎民), ZHANG Tao (张涛), ZHANG Shoubiao (张寿彪), QU Hao (屈浩), HAN Xiang (韩翔), WEN Fei (文斐), KONG Defeng (孔德峰), HUANG Canbin (黄灿斌), CAI Jianqing (蔡剑青), SUN Youwen (孙有文), LIANG Yunfeng (梁云峰), GAO Xiang (高翔), EAST Team. Preliminary Study of the Magnetic Perturbation Effects on the Edge Density Profiles and Fluctuations Using Reflectometers on EAST[J]. Plasma Science and Technology, 2016, 18(9): 879-883. DOI: 10.1088/1009-0630/18/9/01
[5]	WANG Guibin (王桂滨), ZHANG Lin (张林), HE Feng (何锋), OUYANG Jiting (欧阳吉庭). Numerical Study on Microwave Scattering by Various Plasma Objects[J]. Plasma Science and Technology, 2016, 18(8): 791-797. DOI: 10.1088/1009-0630/18/8/01
[6]	ZHU Yilun (朱逸伦), ZHAO Zhenling (赵朕领), TONG Li (仝丽), CHEN Dongxu (陈东旭), XIE Jinlin (谢锦林), LIU Wandong (刘万东). Optics System Design of Microwave Imaging Reflectometry for the EAST Tokamak[J]. Plasma Science and Technology, 2016, 18(4): 449-452. DOI: 10.1088/1009-0630/18/4/20
[7]	QU Hao (屈浩), ZHANG Tao (张涛), ZHANG Shoubiao (张寿彪), WEN Fei (文斐), WANG Yumin (王嵎民), KONG Defeng (孔德峰), HAN Xiang (韩翔), YANG Yao (杨曜), GAO Yu (高宇), HUANG Canbin (黄灿斌), CAI Jianqing (蔡剑青), GAO Xiang (高翔), the EAST team. Q-Band X-Mode Reflectometry and Density Profile Reconstruction[J]. Plasma Science and Technology, 2015, 17(12): 985-990. DOI: 10.1088/1009-0630/17/12/01
[8]	ZHANG Shoubiao(张寿彪), GAO Xiang(高翔), LING Bili(凌必利), WANG Yumin(王嵎民), ZHANG Tao(张涛), HAN Xiang(韩翔), LIU Zixi(刘子奚), BU Jingliang(布景亮), LI Jiangang(李建刚), EAST team. Density Profile and Fluctuation Measurements by Microwave Reflectometry on EAST[J]. Plasma Science and Technology, 2014, 16(4): 311-315. DOI: 10.1088/1009-0630/16/4/02
[9]	ZHANG Chongyang (张重阳), LIU Ahdi (刘阿娣), LI Hong (李弘), LI Bin (李斌), et al.. X-Mode Frequency Modulated Density Profile Reflectometer on EAST Tokamak[J]. Plasma Science and Technology, 2013, 15(9): 857-862. DOI: 10.1088/1009-0630/15/9/04
[10]	ZHANG Wenbo (张文波), WANG Shenggao (王升高), XU Chuanbo (许传波), XU Kaiwei (徐开伟), WANG Mingyang (王明洋), WANG Jianhua (汪建华), HUANG Zhiliang (黄志良), WANG Chuanxin (王传新). Reduction of Ilmenite Through Microwave Plasma[J]. Plasma Science and Technology, 2013, 15(5): 465-468. DOI: 10.1088/1009-0630/15/5/14