Molecular Dynamics Simulations of Deposition and Damage on Tungsten Plasma-Facing Materials by Tungsten Dust

NIU Guojian(牛国鉴); LI Xiaochun(李小椿); DING Rui(丁锐); XU Qian(徐倩); LUO Guangnan(罗广南)

doi:10.1088/1009-0630/16/8/13

Plasma Science and Technology > 2014 > 16(8): 805-808. > DOI: 10.1088/1009-0630/16/8/13

NIU Guojian(牛国鉴), LI Xiaochun(李小椿), DING Rui(丁锐), XU Qian(徐倩), LUO Guangnan(罗广南). Molecular Dynamics Simulations of Deposition and Damage on Tungsten Plasma-Facing Materials by Tungsten Dust[J]. Plasma Science and Technology, 2014, 16(8): 805-808. DOI: 10.1088/1009-0630/16/8/13

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Molecular Dynamics Simulations of Deposition and Damage on Tungsten Plasma-Facing Materials by Tungsten Dust

1 Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 230031, China 2 University of Science and Technology of China, Hefei 230027, China

Funds: supported by National Natural Science Foundation of China (No.11075186) and National Magnetic Confinement Fusion Science Program of China (No.2013GB107004)

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Received Date: August 19, 2013

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Abstract

Classical molecular dynamics has been used to study the interactions between tung- sten (W) plasma-facing materials (PFMs) and dust grains. The impact velocity of dust grains is in the range from 324 m/s to 3240 m/s. The main effect of dust grains with low impact velocity is deposition. However, a material surface can be damaged by high velocity dust grains. The cumulative damage of impacting dust grains has also been take into account. When the impact velocity is low, no significant damage is detected but a porous firm forms on the surface. Serious damage can be produced on PFMs if the impact velocity is high.
- molecular dynamics,
- dust,
- plasma-facing materials

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