1 Chen Qiang, Li Junshuai and Li Yongfeng. 2015, J.Phys. D: Appl. Phys., 48: 424005 2 Kong M G, Liu D. 2014, High Voltage Engineering,40: 2956 (in Chinese) 3 Samukawa S, Hori M, Rauf S, et al. 2014, J. Phys. D:Appl. Phys., 45: 253001 4 Bruggeman Peter, Leys Christophe. 2009, J. Phys. D:Appl. Phys., 42: 053001 5 Lu XinPei, Yan Ping, Ren Chunsheng, et al. 2011, Sci.Sin.: Phys. Mech. Astron., 41: 801 (in Chinese) 6 Jimoh O. Tijani, Ojo O. Fatoba, et al. 2014, Water Air Soil Pollut., 225: 2102 7 Mart′ ?nková L, Uhn′ aková B, P′ atek M, et al. 2009, Environ. Int., 35: 162 8 Pˇ acurariua C, Mihoc G, Popa A, et al. 2013, Chem.Eng. J., 222: 218 9 Han Y X, Boateng A A, Qi P X, et al. 2013, J. Environ.Manage., 118: 196 10 Jiang N, Lu N, Shang K F, et al. 2013, J. Hazard.Mater., 262: 387 11 Chen B Y, Zhu C P, Chen L W, et al. 2014, Plasma Sci. Technol., 16: 1126 12 Wang X X. 2009, High Voltage Engineering, 35: 1 (in Chinese) 13 Shao T, Zhang C, Yu Y, et al. 2012, Vacuum, 86: 876 14 Park C W, Byeon J H, Yoon K Y, et al. 2011, Sep. Purif. Technol., 77: 87 15 Yang Xianli, Bai Mindong, Han Fen, et al. 2009, Water Environ. Res., 81: 450 16 Lin Qifu, Ni Guohua, Jiang Yiman, et al. 2014, Plasma Sci. Technol., 16: 1036 17 Wang Xiaoping, Li Zhongjian, Zhang Xingwang, et al. 2014, Plasma Sci. Technol., 16: 479 18 Azooz A A and Waysi S I. 2014, Plasma Sci. Technol.,16: 211 19 Yu Jianyang, Liu Huaping, Xu Dimeng, et al. 2014,Plasma Sci. Technol., 16: 197 20 Lu Na, Feng Yingchun, Li Jie, et al. 2015, IEEE Trans. Plasma Sci., 43: 580 21 Wandell R J, Locke B R. 2014, IEEE Trans. Plasma Sci., 42: 2634 22 Kim K S, Gam S G, Mok Y S. 2015, Chem. Eng. J.,271: 31 23 Jiang Song, Wen Yiyong, Liu Kefu. 2014, Plasma Sci. Technol., 16: 59 24 Bourdelle Franck, Truche Laurent, Pignatelli Isabella, et al. 2014, Chem. Geol., 381: 194 25 Ma Yajuan, Liu Bing, Zhang Yuhua, et al. 2015, Int. J. Hydrogen Energ., 40: 9147 26 Zhao Zhengfeng, Wang Yingzi, Xu Jing, et al. 2015,Appl. Surf. Sci., 351: 416 27 Santangelo P E. 2010, Exp. Therm. Fluid Sci., 34:1353 28 Wiksten R, Assad M E H. 2007, Int. J. Refrig., 30:1207 29 Zhou C H, Cheng S B, Sun J L, et al. 2009, J. Phys.Chem. A, 113: 4923 30 Charles de Izarra. 2000, J. Phys. D: Appl. Phys., 33:1697 31 Yang Q S, Jiang Z L, Peng Z M, et al. 2011, Acta Phys. Sin., 60: 053302 (in Chinese) 32 Dong Lifang, Zhao Longhu, Wang Yongjie, et al. 2014, Specrtosc. Spect. Anal., 34: 308 33 Cybulski H, Bielski A, Ciury? lo R, et al. 2013, J. Quant. Spectrosc. Ra., 120: 90 34 Vyrodov A O, Heinze J, and Meier U E. 1995, J. Quant. Spectrosc. Ra., 53: 227 35 Knutsen K, Dyer M J, and Richard A. 1996, J. Chem. Phys., 104: 5798 36 Li X Y, Lin Z X, Liu Y Y, et al. 2004, Acta Optical Sin., 24: 1051 37 Chen L W, Yu W, Xiao Z, et al. 2012, Thin Solid Films, 521: 226 38 Wang Ruixue, Zhang Cheng, Shen Yuan, et al. 2015,J. Appl. Phys., 118: 123303 39 Kogelschatz U. 2003, Plasma Chem. Plasma Process.,23: 1 40 Abdelaziz A A, Seto T, Abdel S M, et al. 2015, J.Phys. D: Appl. Phys., 48: 195201 41 Abdelaziz A A, Seto T, Abdel S M, et al. 2013, J.Hazard. Mater., 246-247: 26 42 Andreas S, James Y J, Steven E B, et al, 1998, IEEE Trans. Plasma Sci., 26: 1685 43 Yoon J S, Song M Y, Kwon D C, et al. 2014, Physics Reports, 543: 199 44 Liu K F, Zhao H Y, Qiu J. 2009, High Voltage Engineering, 35: 12 (in Chinese) 45 Penetrante B M, Hsiao M C, Bardsley J N, et al. 1997,Plasma Sources Sci. Technol., 6: 251 46 Shih K Y, Bruce R. 2011, IEEE Trans. Plasma Sci.,39: 883 47 Oba Y, Watanabe N, Kouchi A, et al. 2011, Phys.Chem. Chem. Phys., 13: 15792 48 Leong C H, Ponnivalavan B, Rajnish K, et al. 2013,Energy, 63: 252 49 Tas M A, Hardeveld R, Veldhuizen E M. 1997, Plasma Chem. Plasma Process., 17: 371 50 Bagheri M, Mohseni M. 2014, Chem. Eng. J., 256: 51 51 Casasanta G, Sarra A, Meloni D, et al. 2011, Atmos.Environ., 45: 3937 52 Pfister G, Baumgartner D, Maderbacher R, et al. 2000, Atmos. Environ., 34: 4019
|