Surface Modification of Polyimide Film by Dielectric Barrier Discharge at Atmospheric Pressure

PENG Shi (彭释); LI Lingjun (李灵均); LI Wei (李炜); WANG Chaoliang (王超梁); GUO Ying (郭颖); SHI Jianjun (石建军); ZHANG Jing (张菁)

doi:10.1088/1009-0630/18/4/01

Plasma Science and Technology > 2016 > 18(4): 337-341. > DOI: 10.1088/1009-0630/18/4/01

PENG Shi (彭释), LI Lingjun (李灵均), LI Wei (李炜), WANG Chaoliang (王超梁), GUO Ying (郭颖), SHI Jianjun (石建军), ZHANG Jing (张菁). Surface Modification of Polyimide Film by Dielectric Barrier Discharge at Atmospheric Pressure[J]. Plasma Science and Technology, 2016, 18(4): 337-341. DOI: 10.1088/1009-0630/18/4/01

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Surface Modification of Polyimide Film by Dielectric Barrier Discharge at Atmospheric Pressure

1College of Textile, Donghua University, Shanghai 201620, China 2Department of Applied Physics, Donghua University, Shanghai 201620, China 3Member of Magnetic Confinement Fusion Research Center, Ministry of Education, Donghua University, Shanghai 201620, China

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Received Date: August 30, 2015

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Abstract

Abstract

In this paper, polyimide (PI) films are modified using an atmospheric pressure plasma generated by a dielectric barrier discharge (DBD) in argon. Surface performance of PI film and its dependence on exposure time from 0 s to 300 s are investigated by dynamic water contact angle (WCA), field emission scanning electron microscopy (FESEM), and Fourier trans?form infrared spectroscopy in attenuated total multiple reflection mode (FTIR-ATR). The study demonstrates that dynamic WCA exhibits a minimum with 40 s plasma treatment, and evenly distributed nano-dots and shadow concaves appeared for 40 s and 12 s Ar plasma treatment individually. A short period of plasma modification can contribute to the scission of the imide ring and the introduction of C-O and C=O (-COOH) by detailed analysis of FTIR-ATR.
- DBD,
- atmospheric pressure,
- surface modification,
- polyimide,
- treatment du?ration

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