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Ling ZHANG (张玲), Guo CHEN (陈果), Zhibing HE (何智兵), Xing AI (艾星), Jinglin HUANG (黄景林), Lei LIU (刘磊), Yongjian TANG (唐永建), Xiaoshan HE (何小珊). Investigation of working pressure on the surface roughness controlling technology of glow discharge polymer films based on the diagnosed plasma[J]. Plasma Science and Technology, 2017, 19(7): 75505-075505. DOI: 10.1088/2058-6272/aa6618
Citation: Ling ZHANG (张玲), Guo CHEN (陈果), Zhibing HE (何智兵), Xing AI (艾星), Jinglin HUANG (黄景林), Lei LIU (刘磊), Yongjian TANG (唐永建), Xiaoshan HE (何小珊). Investigation of working pressure on the surface roughness controlling technology of glow discharge polymer films based on the diagnosed plasma[J]. Plasma Science and Technology, 2017, 19(7): 75505-075505. DOI: 10.1088/2058-6272/aa6618

Investigation of working pressure on the surface roughness controlling technology of glow discharge polymer films based on the diagnosed plasma

Funds: This study was financially supported by National Natural Science Foundation of China (No. 51401194).
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  • The effects of working pressure on the component, surface morphology, surface roughness, and deposition rate of glow discharge polymer (GDP) films by a trans-2-butene/hydrogen gas mixture were investigated based on plasma characteristics diagnosis. The composition and ion energy distributions of a multi-carbon (C4H8/H2) plasma mixture at different working pressures were diagnosed by an energy-resolved mass spectrometer (MS) during the GDP film deposition process. The Fourier transform infrared spectroscopy (FT–IR), field emission scanning electron microscope (SEM) and white-light interferometer (WLI) results were obtained to investigate the structure, morphology and roughness characterization of the deposited films, respectively. It was found that the degree of ionization of the C4H8/H2 plasma reduces with an increase in the working pressure. At a low working pressure, the C–H fragments exhibited small-mass and high ion energy in plasma. In this case, the film had a low CH3/CH2 ratio, and displayed a smooth surface without any holes, cracks or asperities. While the working pressure increased to 15 Pa, the largest number of large-mass fragments led to the deposition rate reaching a maximum of 2.11 μm h−1, and to hole defects on the film surface. However, continuing to increase the working pressure, the film surface became smooth again, and the interface between clusters became inconspicuous without etching pits.
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