Citation: | In-Mok YANG, Jun-Seok NAM, Min-Kyu CHOI, Jun-Ho SEO, Shi-Young YANG. Effects of inter-electrode insertion on the performance and thermal flow fields of a hollow-electrode plasma torch[J]. Plasma Science and Technology, 2020, 22(1): 15403-015403. DOI: 10.1088/2058-6272/ab4922 |
[1] |
Heberlein J and Murphy A B 2008 J. Phys. D: Appl. Phys. 41 053001
|
[2] |
Murata M et al 2005 Nippon Steel Tech. Rep. 92 30 (www.nipponsteel.com/en/tech/report/nsc/pdf/n9206.pdf )
|
[3] |
Minutillo M, Perna A and Bona D D 2009 Energy Convers.Manag. 50 2837
|
[4] |
Chang J S 2009 Int. J. Plasma Environ. Sci. Technol. 3 67
|
[5] |
Tzeng C C et al 1998 J. Hazard. Mater. 58 207
|
[6] |
Deckers J 2014 The innovative plasma tilting furnace for industrial treatment of radioactive waste-14420 WM2014 Conf. Proc. (Phoenix, Arizona, 2–6 March 2014) (Tempe AZ: WM Symposia Inc.)
|
[7] |
Fauchais P and Vardelle A 1997 IEEE Trans. Plasma Sci.25 1258
|
[8] |
Krogh O, Carlile R N and Nowlin R N 1995 Plasma Chem.Plasma Process. 15 231
|
[9] |
Garam J 2013 A study on design and manufacture of arc heater facility using computational fluid dynamics PhD Thesis Seoul National University (http://dcollection.snu.ac.kr/public_resource/pdf/000000012993_20191015233902.pdf )
|
[10] |
Santen S et al 1985 Means for electrically heating gases US Patent No. 4543470US Patent and Trademark Office (https://patentimages.storage.googleapis.com/bc/b5/51/0fd180fce1e7f0/US4543470.pdf )
|
[11] |
Patankar S V 1980 Computational Fluid Flow and Heat Transfer (New York: McGraw-Hill)
|
[12] |
Trelles J P et al 2009 J. Therm. Spray Technol. 18 728
|
[13] |
Launder B E and Spalding D B 1974 Comput. Methods Appl.Mech. Eng. 3 269
|
[14] |
Boulos M I, Fauchais P and Wender E 1994 Thermal Plasmas:Fundamentals and Applications vol 1 (New York: Plenum Press)
|
[15] |
Trelles J P, Pfender E and Heberlein J V R 2007 J. Phys. D: Appl. Phys. 40 5635
|
[16] |
Hur M and Hong S H 2002 J. Phys. D: Appl. Phys. 35 1946
|
[17] |
Paik S et al 1993 Plasma Chem. Plasma Process. 13 379
|
[18] |
Hirsh M N and Oskam H J 1978 Gaseous Electronics: Electrical Discharges (New York: Academic)
|
[19] |
Yang I M et al 2019 J. Korean Phys. Soc. 74 465
|
[20] |
Sun H et al 2016 J. Phys. D: Appl. Phys. 49 055204
|
[21] |
Wu Y et al 2016 J. Phys. D: Appl. Phys. 49 425202
|
[22] |
Shaeffer J F 1978 AIAA J. 16 1068
|
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