Abstract: This review describes the application of non-thermal plasma (NTP) technology for high barrier layer fabrication in packaging area. NTP technology is considered to be the most prospective approaches for the barrier layer fabrication over the past decades due to unpollution, high speed, low-costing. The applications of NTP technology have achieved numerous exciting results in high barrier packaging area. Now it seemly demands a detailed review to summarize the past works and direct the future developments. This review focuses on the different NTP resources applied in the high barrier area, the role of plasma surface modification on packaging film surface properties, and the deposition of different barrier coatings based on NTP technology. In particular, this review emphasizes the cutting-edge technologies of NTP on interlayer deposition with organic, inorganic for multilayer barriers fabrication. The future prospects of NTP technology in high barrier film areas are also described.