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CHEN Xu (陈旭), TIAN Shuping (田树平), HE Pingni (贺平逆), ZHAO Chengli (赵成利), SUN Weizhong (孙伟中), ZHANG Junyuan (张俊源), CHEN Feng (陈峰), GOU Fujun (苟富均). Angular E®ects on F+ Etching SiC: MD Study[J]. Plasma Science and Technology, 2012, 14(12): 1102-1105. DOI: 10.1088/1009-0630/14/12/12
Citation: CHEN Xu (陈旭), TIAN Shuping (田树平), HE Pingni (贺平逆), ZHAO Chengli (赵成利), SUN Weizhong (孙伟中), ZHANG Junyuan (张俊源), CHEN Feng (陈峰), GOU Fujun (苟富均). Angular E®ects on F+ Etching SiC: MD Study[J]. Plasma Science and Technology, 2012, 14(12): 1102-1105. DOI: 10.1088/1009-0630/14/12/12
  • Molecular dynamics (MD) simulations were performed to investigate F+ continu- ously bombarding SiC surfaces with energies of 100 eV at di®erent incident angles at 300 K. The simulated results show that the steady-state uptake of F atoms increases with increasing incident angle. With the steady-state etching established, a Si-C-F reactive layer is formed. It is found that the etching yield of Si is greater than that of C. In the F-containing reaction layer, the SiF species is dominant with incident angles less than 30o. For all incident angles, the CF species is dominant over CF2 and CF3.
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