Advanced Search+
ZHANG Xiaofeng (张小锋), LIU Weiliang (刘维良), YU Lei (于磊), LI Yujie (李玉杰), et al.. Observation of the Structure of Tungsten Films Prepared by MOCVD[J]. Plasma Science and Technology, 2013, 15(9): 955-960. DOI: 10.1088/1009-0630/15/9/23
Citation: ZHANG Xiaofeng (张小锋), LIU Weiliang (刘维良), YU Lei (于磊), LI Yujie (李玉杰), et al.. Observation of the Structure of Tungsten Films Prepared by MOCVD[J]. Plasma Science and Technology, 2013, 15(9): 955-960. DOI: 10.1088/1009-0630/15/9/23

Observation of the Structure of Tungsten Films Prepared by MOCVD

Funds: supported by the National Magnetic Confinement Fusion Program of China, ITER (No.2010GB109000)
More Information
  • Received Date: May 15, 2012
  • The tungsten films with ultra microstructure on CuCrZr alloy and China Low Acti- vation Martensitic (CLAM) steel have been prepared by metal organic chemical vapor deposition (MOCVD). The films were produced by pyrolysing the tungsten hexacarbonyl at air or argon atmosphere. When formed at or below 400 ? C, they were poorly crystalized and the films showed low quality in thickness, density, bonding performance etc. While above this temperature, the properties of tungsten films have been improved, all the films consist of tungsten in the β-W. And β-W can change into α-W after heat treatment. As in other variations of pyrolysis, oxy- gen and carbon were observed. When filled with argon, the oxygen and carbon content would reduce apparently. Tungsten films prepared by MOCVD have stable chemical composition and microstructure. Besides, the properties of films on CuCrZr alloy are better than that on CLAM steel.
  • Related Articles

    [1]Baoguo WANG (王保国), Dahuan ZHU (朱大焕), Rui DING (丁锐), Junling CHEN (陈俊凌). Thermal analysis on the EAST tungsten plasma facing components with shaping structure counteracting the misalignment issues[J]. Plasma Science and Technology, 2017, 19(2): 25603-025603. DOI: 10.1088/2058-6272/19/2/025603
    [2]WU Ding (吴鼎), LIU Ping (刘平), SUN Liying (孙立影), HAI Ran (海然), DING Hongbin (丁洪斌). Influence of a Static Magnetic Field on Laser Induced Tungsten Plasma in Air[J]. Plasma Science and Technology, 2016, 18(4): 364-369. DOI: 10.1088/1009-0630/18/4/06
    [3]PENG Shi (彭释), LI Lingjun (李灵均), LI Wei (李炜), WANG Chaoliang (王超梁), GUO Ying (郭颖), SHI Jianjun (石建军), ZHANG Jing (张菁). Surface Modification of Polyimide Film by Dielectric Barrier Discharge at Atmospheric Pressure[J]. Plasma Science and Technology, 2016, 18(4): 337-341. DOI: 10.1088/1009-0630/18/4/01
    [4]NIU Guojian(牛国鉴), LI Xiaochun(李小椿), DING Rui(丁锐), XU Qian(徐倩), LUO Guangnan(罗广南). Molecular Dynamics Simulations of Deposition and Damage on Tungsten Plasma-Facing Materials by Tungsten Dust[J]. Plasma Science and Technology, 2014, 16(8): 805-808. DOI: 10.1088/1009-0630/16/8/13
    [5]LI Maijuan(李麦娟), FU Yanbiao(符彦飙), SU Maogen(苏茂根), DONG Chenzhong(董晨钟), Koike FUMIHIRO. Dielectronic Recombination of Br-Like Tungsten Ions[J]. Plasma Science and Technology, 2014, 16(3): 182-187. DOI: 10.1088/1009-0630/16/3/02
    [6]YU Xingang (余新刚), GOU Fujun (苟富均). Molecular Dynamics Study on the Diffusion Properties of Hydrogen Atoms in Bulk Tungsten[J]. Plasma Science and Technology, 2013, 15(7): 710-715. DOI: 10.1088/1009-0630/15/7/19
    [7]ZHU Dahuan (朱大焕), LIU Yang (刘洋), CHEN Junling (陈俊凌), ZHOU Zhangjian (周张健), YAN Rong (鄢容). Surface Cracking Behaviors of Ultra-Fine Grained Tungsten Under Edge Plasma Loading in the HT-7 Tokamak[J]. Plasma Science and Technology, 2013, 15(6): 605-608. DOI: 10.1088/1009-0630/15/6/21
    [8]Miyuki YAJIMA, Masato YAMAGIWA, Shin KAJITA, Noriyasu OHNO, Masayuki TOKITANI, Arimichi TAKAYAM, Seiki SAITO, Atsushi M. ITO, Hiroaki NAKAMURA, Naoaki YOSHIDA. Comparison of Damages on Tungsten Surface Exposed to Noble Gas Plasmas[J]. Plasma Science and Technology, 2013, 15(3): 282-286. DOI: 10.1088/1009-0630/15/3/18
    [9]Takanori MIYAMOTO, Shuichi TAKAMURA, Hiroaki KURISHITA. Recovery of Tungsten Surface with Fiber-Form Nanostructure by Plasmas Exposures[J]. Plasma Science and Technology, 2013, 15(2): 161-165. DOI: 10.1088/1009-0630/15/2/17
    [10]LIU bo (刘波), YANG JiJun (杨吉军), JIAO Guohua (焦国华), XU KeWei (徐可为). Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film[J]. Plasma Science and Technology, 2012, 14(7): 619-623. DOI: 10.1088/1009-0630/14/7/12

Catalog

    Article views (302) PDF downloads (856) Cited by()

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return