1 Mostaghimi J and Boulos M I. 2015, Plasma Chem.Plasma Process., 35: 421 2 Fauchais P, Vardelle M, Goutier S, et al. 2015, Plasma Chem. Plasma Process., 35: 511 3 Ma W, Fei Q, Pan W, et al. 2006, Applied Surface Science, 252: 3541 4 Shigeta M and Murphy A B. 2011, Journal of Physics D: Applied Physics, 44: 4025 5 Sun W, Hu R, Liu H, et al. 2014, Journal of Power Sources, 268: 610 6 Solonenko O P and Smirnov A V. 2014, Journal of Physics, 550: 2017 7 Murphy A B. 2015, Plasma Chem. Plasma Process.,35: 471 8 Chen M, Meng Y, Shi J, et al. 2009, Plasma Science and Technology, 11: 62 9 Pan W, Zhang W, Zhang W, et al. 2001, Plasma Chem. Plasma Process., 21: 23 10 Vardelle A, Moreau C, Themelis N J, et al. 2015,Plasma Chem. Plasma Process., 35: 491 11 Pan W, Zhang W, Ma W, et al. 2002, Plasma Chem.Plasma Process., 22: 271 12 Pan W, Meng X, Chen X, et al. 2006, Plasma Chem.Plasma Process., 26: 335 13 Osaki K, Fukumasa O and Kobayashi A. 2000, Vacuum, 59: 47 14 Pan W, Meng X and Wu C. 2006, Plasma Science and Technology, 8: 416 15 Miao J, Yu D, Cao X, et al. 2015, Plasma Chem.Plasma Process., 35: 879 16 Cao X, Yu D, Xiang Y, et al. 2016, Plasma Chem.Plasma Process., 36: 693
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