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Manping LI (李曼苹), Kai WU (吴锴), Zhao ZHANG (张钊), Yonghong CHENG (成永红). Effect of toughened epoxy resin on partial discharge at solid–solid interface[J]. Plasma Science and Technology, 2017, 19(2): 25401-025401. DOI: 10.1088/2058-6272/19/2/025401
Citation: Manping LI (李曼苹), Kai WU (吴锴), Zhao ZHANG (张钊), Yonghong CHENG (成永红). Effect of toughened epoxy resin on partial discharge at solid–solid interface[J]. Plasma Science and Technology, 2017, 19(2): 25401-025401. DOI: 10.1088/2058-6272/19/2/025401

Effect of toughened epoxy resin on partial discharge at solid–solid interface

Funds: Supported by China Academy of Engineering Physics (Project 2014B05005).
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  • Received Date: March 05, 2016
  • A series of solid–solid interfaces, consisting of ceramic–epoxy resin interface samples with a tip–plate electrode, were investigated by performing partial discharge tests and realtime electrical tree observations. A toughening agent was added to the epoxy resin at different ratios for comparison. The impact strength, differential scanning calorimetry (DSC) and dielectric properties of the cured compositions and ceramic were tested. The electric field strength at the tip was calculated based on Maxwell’s theory. The test results show that the addition of a toughener can improve the impact strength of epoxy resin but it decreases the partial discharge inception voltage (PDIV) of the interface sample. At the same time, toughening leads to complex branches of the electrical tree. The simulation result suggests that this reduction of the PDIV cannot be explained by a change of permittivity due to the addition of a toughening agent. The microstructural change caused by toughening was considered to be the key factor for lower PDIV and complex electrical tree branches.
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