Analysis of residual thermal stress in CVD-W coating as plasma facing material

ZHU Dahuan (朱大焕); WANG Kun (王坤); WANG Xianping (王先平); CHEN Junling (陈俊凌); FANG Qianfeng (方前锋)

doi:10.1088/1009-0630/14/7/20

Plasma Science and Technology > 2012 > 14(7): 656-660. > DOI: 10.1088/1009-0630/14/7/20

ZHU Dahuan (朱大焕), WANG Kun (王坤), WANG Xianping (王先平), CHEN Junling (陈俊凌), FANG Qianfeng (方前锋). Analysis of residual thermal stress in CVD-W coating as plasma facing material[J]. Plasma Science and Technology, 2012, 14(7): 656-660. DOI: 10.1088/1009-0630/14/7/20

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Analysis of residual thermal stress in CVD-W coating as plasma facing material

1 Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 230031, China 2 Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, Hefei 230031, China

Funds: supported by the Key Project of Chinese Academy of Science (No.KJCX2-YW_N35) and National Natural Science Foundation of China(No.11175205)

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Received Date: May 16, 2011

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Abstract

Abstract

Chemical vapor deposition-tungsten (CVD-W) coating covering the surface of the plasma facing component (PFC) is an effective method to implement the tungsten material as plasma facing material (PFM) in fusion devices. Residual thermal stress in CVD-W coating due to thermal mismatch between coating and substrate was successfully simulated by using a finite element method (ANSYS 10.0 code). The deposition parametric effects, i.e., coating thickness and deposition temperature, and interlayer were investigated to get a description of the residual thermal stress in the CVD-W coating-substrate system. And the influence of the substrate materials on the generation of residual thermal stress in the CVD-W coating was analyzed with respect to the CVD-W coating application as PFM. This analysis is beneficial for the preparation and application of CVD-W coating.
- W-coating,
- CVD,
- residual thermal stress,
- PFM,
- FEA

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