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ZHAO Chengli (赵成利), DENG Chaoyong (邓朝勇), SUN Weizhong(孙伟中), ZHANG Junyuan (张浚源), CHEN Feng (陈峰), HE Pingni (贺平逆), CHEN Xu (陈旭), GOU Fujun (芶富均). Etching Mechanisms of CF3 Etching Fluorinated Si: Molecular Dynamics Simulation[J]. Plasma Science and Technology, 2012, 14(7): 670-674. DOI: 10.1088/1009-0630/14/7/23
Citation: ZHAO Chengli (赵成利), DENG Chaoyong (邓朝勇), SUN Weizhong(孙伟中), ZHANG Junyuan (张浚源), CHEN Feng (陈峰), HE Pingni (贺平逆), CHEN Xu (陈旭), GOU Fujun (芶富均). Etching Mechanisms of CF3 Etching Fluorinated Si: Molecular Dynamics Simulation[J]. Plasma Science and Technology, 2012, 14(7): 670-674. DOI: 10.1088/1009-0630/14/7/23

Etching Mechanisms of CF3 Etching Fluorinated Si: Molecular Dynamics Simulation

Funds: supported financially by Guizhou Province of China (No.:700968101) and International Thermonuclear Experimental Reactor (ITER) program special ( No. 2009GB104006)
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  • Received Date: May 16, 2011
  • Molecular dynamics simulations are performed to investigate CF3 continuously bombarding the amorphous silicon surface with energies of 10, 50, 100 and 150 eV at normal incidence and room temperature. The improved Tersoff-Brenner potentials were used. The simulation results show that the steady-state etching rates are about 0.019, 0.085 and 0.1701 for 50, 100 eV and 150eV, respectively. With increasing incident energy, a transition from C-rich surface to F-rich surface is observed. In the region modified by CF3, SiF and CF species are dominant.

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