Citation: | GU Ling(古玲). Esterification by the Plasma Acidic Water: Novel Application of Plasma Acid[J]. Plasma Science and Technology, 2014, 16(3): 223-225. DOI: 10.1088/1009-0630/16/3/09 |
1 Marshall W L, Franck E U. 1981, Journal of Physical and Chemical Reference Data, 10: 295;
|
2 Akiya N, Savage P E. 2002, Chemical Reviews, 102:2725;
|
3 Savage P E, Gopalan S, Mizan T I, et al. 1995, AIChE Journal, 41: 1723;
|
4 Katritzky A R, Allin S M. 1996, Accounts of Chemical Research, 29: 399;
|
5 Jessop P G, Ikariya T, Noyori R. 1995, Science, 269:1065;
|
6 Zou J J, Zhang Y P, Liu C J. 2007, Journal of Power Sources, 163: 653;
|
7 Zou J J, Zhang Y P, Liu C J. 2007, International Jour-nal of Hydrogen Energy, 32: 958;
|
8 Lu B, Ji M. 2012, Plasma Chemistry and Plasma Pro-cessing, 32: 1025;
|
9 Liu F, Yu J, Bai X D. 2012, Applied Surface Science,258: 10191;
|
10 Zou J J, Zhang Y P, Liu C J, et al. 2003, Plasma Chemistry and Plasma Processing, 23: 69;
|
11 Zou J J, Liu C J, Zhang Y P. 2006, Energy & Fuels,20: 1674;
|
12 Yang H M, Hou W H, Zhang H R, et al. 2012, Journal of Advanced Oxidation Technologies, 15: 321;
|
13 Zou J, Liu C. 2004, Plasma Science and Technology,6: 2585;
|
14 Zou J J, Zhang Y P, Liu C J. 2006, Langmuir, 22: 2334 ;
|
15 Zou J J, Zhang Y P, Liu C J. 2006, Langmuir, 22:11388;
|
16 Zou J J, He H, Cui L, et al. 2007, International Journal of Hydrogen Energy, 32: 1762;
|
17 Shainsky N, Dobrynin D, Ercan U, et al. 2012, Plasma Processes and Polymers, 9: 555;
|
18 Ikawa S, Kitano K, Hamaguchi S. 2010, Plasma Pro-cesses and Polymers, 7: 33;
|
19 Ho?mann M M, Conradi M S. 1997, Journal of the American Chemical Society, 119: 3811;
|
20 Marx D, Tuckerman M E, Hutter J, et al. 1999, Na-ture, 397: 601
|
[1] | MIAO Chunguang (苗春光), WANG Xiangqin (王相勤). Mass Deposition, Etching and Sputtering Effects of Low-Energy N + Ion Irradiation on Solid Fly Ash[J]. Plasma Science and Technology, 2013, 15(12): 1232-1236. DOI: 10.1088/1009-0630/15/12/13 |
[2] | YU Binbin (于斌斌), YUAN Juntang (袁军堂), WANG Zhenhua (汪振华), HU Xiaoqiu (胡小秋). Research on the Mechanism of Multilayer Reactive Ion Etching[J]. Plasma Science and Technology, 2013, 15(8): 825-829. DOI: 10.1088/1009-0630/15/8/21 |
[3] | ZHANG Peng (张鹏), WANG Jun (王俊), SUN Yang (孙阳), DING Zejun (丁泽军). Charging Effect in Plasma Etching Mask of Hole Array[J]. Plasma Science and Technology, 2013, 15(6): 570-576. DOI: 10.1088/1009-0630/15/6/15 |
[4] | CHEN Xu (陈旭), TIAN Shuping (田树平), HE Pingni (贺平逆), ZHAO Chengli (赵成利), SUN Weizhong (孙伟中), ZHANG Junyuan (张俊源), CHEN Feng (陈峰), GOU Fujun (苟富均). Angular E®ects on F+ Etching SiC: MD Study[J]. Plasma Science and Technology, 2012, 14(12): 1102-1105. DOI: 10.1088/1009-0630/14/12/12 |
[5] | ZHENG Yanbin (郑艳彬), LI Guang (李光), WANG Wenlong (王文龙), LI Xiuchang (李秀昌), JIANG Zhigang(姜志刚). Dry Etching Characteristics of Amorphous Indium-Gallium-Zinc-Oxide Thin Films[J]. Plasma Science and Technology, 2012, 14(10): 915-918. DOI: 10.1088/1009-0630/14/10/11 |
[6] | DAI Zhongling(戴忠玲), YUE Guang(岳光), WANG Younian(王友年). Simulations of Ion Behaviors in a Photoresist Trench During Plasma Etching Driven by a Radio-Frequency Source[J]. Plasma Science and Technology, 2012, 14(3): 240-244. DOI: 10.1088/1009-0630/14/3/10 |
[7] | WANG Qing (王庆), WANG Yongfu (王永富), BA Dechun (巴德纯), YUE Xiangji (岳向吉). The Effect of Ion Current Density on Target Etching in Radio Frequency-Magnetron Sputtering Process[J]. Plasma Science and Technology, 2012, 14(3): 235-239. DOI: 10.1088/1009-0630/14/3/09 |
[8] | LIU Xuelan (刘雪兰), XU An (许安), DAI Yin (戴银), YUAN Hang (袁航), YU Zengliang (余增亮). Surface Etching and DNA Damage Induced by Low-Energy Ion Irradiation in Yeast[J]. Plasma Science and Technology, 2011, 13(3): 381-384. |
[9] | D. S. RAWAL, B. K. SEHGAL, R. MURALIDHARAN, H. K. MALIK. Experimental Study of the Influence of Process Pressure and Gas Composition on GaAs Etching Characteristics in Cl2/BCl3-Based Inductively Coupled Plasma[J]. Plasma Science and Technology, 2011, 13(2): 223-229. |
[10] | M. RADMILOVIC-RADJENOVIC, B. RADJENOVIC. The Effects of Chemical (isotropic) and Anisotropic Etching Processes on the Roughening of Nanocomposite Substrates[J]. Plasma Science and Technology, 2010, 12(6): 673-676. |