Advanced Search+
Emmanouil D. FYLLADITAKIS, Antonios X. MORONIS, Konstantinos KIOUSIS. Design of a Prototype EHD Air Pump for Electronic Chip Cooling Applications[J]. Plasma Science and Technology, 2014, 16(5): 491-501. DOI: 10.1088/1009-0630/16/5/09
Citation: Emmanouil D. FYLLADITAKIS, Antonios X. MORONIS, Konstantinos KIOUSIS. Design of a Prototype EHD Air Pump for Electronic Chip Cooling Applications[J]. Plasma Science and Technology, 2014, 16(5): 491-501. DOI: 10.1088/1009-0630/16/5/09

Design of a Prototype EHD Air Pump for Electronic Chip Cooling Applications

More Information
  • Received Date: November 13, 2012
  • This paper presents the design, optimization and fabrication of an EHD air pump intended for high-power electronic chip cooling applications. Suitable high-voltage electrode con- figurations were selected and studied, in terms of the characteristics of the generated electric field, which play an important role in ionic wind flow. For this purpose, dedicated software is used to implement finite element analysis. Critical design parameters, such as the electric field intensity, wind velocity, current flow and power consumption are investigated. Two different laboratory prototypes are fabricated and their performances experimentally assessed. This procedure leads to the fabrication of a final prototype, which is then tested as a replacement of a typical fan for cooling a high power density electronic chip. To assist towards that end, an experimental ther- mal testing setup is designed and constructed to simulate the size of a personal computer’s CPU core of variable power. The parametric study leads to the fabrication of experimental single-stage EHD pumps, the optimal design of which is capable of delivering an air flow of 51 CFM with an operating voltage of 10.5 kV. Finally, the theoretical and experimental results are evaluated and potential applications are proposed.
  • 1. Cabeo N. 1629, Philosophia magnetica. Cologne
    2. Hauksbee F. 1709, Physico-mechanical experiments on various subjects. London
    3. Newton I. 1718, Opticks. London
    4. Chattock A P. 1899, Philosophical Magazine, 48: 401
    5. Lob E. 1954, Archiv der elektrischen Uebertragung,p.8
    6. Cravens D J. 1990, Electric propulsion study (AL-TR-89-040). Air Force Astronautics Lab, Edwards AFB, CA1990
    7. Martins A A and Pinheiro M J. 2011, Journal of Elec-trostatics, 69: 133
    8. Chua B, Logeeswaran V, Chan M, et al. 2005. An elec-trohydrodynamically driven microfabricated actuator for the study of miniature ion propulsion engine and electric wind devices. The 13th International Confer-ence on, Solid-State Sensors, Actuators and Microsys-tems, 2005. Digest of Technical Papers. TRANSDUC-ERS’05. p.197
    9. Velko. H R and Kulacki F A. 1977, Electrostatic cool-ing. American Society of Mechanical Engineers, Issue 77-DE-36, Chicago
    10. Schmid H J, Stolz S, and Buggisch H. 2002, Flow, Tur-bulence and Combustion, 68: 63
    11. Lynikiene S. 2001, CIGR Journal of Scienti.c Research and Development, 3: 021
    12. Wang J M and Yang L J. 2005, Tamkang Journal of Science and Engineering, 8: 231
    13. Qiu Wei, Xia Lingzhi, Yang Lanjun, et al. 2011, Plasma Science and Technology, 13: 693
    14.Tanski M, Kocik M, and Mizeraczyk J. 2011, IEEE Transactions on Dielectrics and Electrical Insulation, 18: 1429
    15 Singhal V and Garimella S V. 2007, Sensors and Ac-tuators A: Physical, 134: 650
    16 Kim C and Hwang J. 2012, Journal of Physics D: Ap-plied Physics, 45: 465204
    17 Moreau E and Touchard G. 2008, Journal of Electro-statics, 66: 39
    18. Jewell-Larsen N E, Ran H, Zhang Y, et al. 2009, Semiconductor Thermal Measurement and Manage-ment Symposium. SEMI-THERM 2009. 25th Annual IEEE, p.261
    19. Kim B, Lee S, Lee Y S, et al. 2012, Journal of Elec-trostatics, 70: 438
    20. Otsubo Y and Edamura K. 1998, Rheologica Acta, 37: 500
    21. Chua B, Wexler A S, Tien N C, et al. 2008, Journal of Microelectromechanical Systems, 17: 115
    22. Meeker. D. 2012,. Finite. Element. Method. Mag-netics. (FEMM). Software,. Version. 4.2. Available:http://www.femm.info.
    23. Kantouna K, Fotis G P, Kiousis K N, et al. 2012, Anal-ysis of a Cylinder-Wire-Cylinder Electrode Con.gura-tion during Corona Discharge. Presented at the 1st In-ternational Conference on Circuits, Systems, Commu-nications, Computers and Applications (CSCCA ’12) “G. Enescu” University, Iasi, Romania
    24. Intel Corporation. (August 25, 2012). 2nd Genera-tion Intel. CoreTM Processor Family Desktop and Intel. Pentium. Processor Family Desktop, and LGA1155 Socket. Thermal Mechanical Speci.ca-tions and Design Guidelines (TMSDG). Available: http://www.intel.com/content/dam/doc/guide/2nd-gen-core-lga1155-socket-guide.pdf
    25. ARCTIC COOLING AG. 2012. Alpine 11 PLUS. Available: http: //www.arctic.ac/en/p/cooling/cpu /461/alpine-11-plus.html
    26. Moreau E and Touchard G. 2007, Journal of Electro-statics, 66: 39
    27. Saha D. 2007, Local phenomena associated with natu-ral circulation. Presented at the IAEA Training Course on Natural Circulation in Water Cooled Nuclear Power Plants, Bhabha Atomic Research Centre, India
    28. Idelchik I E and Steinberg O. 1996, Handbook of Hy-draulic Resistance. Begell House, New York
    29. Evercool. (2012, 21 August 2012). Ever Green Fan Speci.cations. Available: http: //www.evercool.com. tw/products/fan egf.htm
  • Related Articles

    [1]Shuailing LU, Xuebin MA, Songlin LIU. Preliminary electromagnetic analysis of the COOL blanket for CFETR[J]. Plasma Science and Technology, 2024, 26(1): 015601. DOI: 10.1088/2058-6272/ad0c23
    [2]Guozhan LI (李国占), Jianyang YU (俞建阳), Huaping LIU (刘华坪), Fu CHEN (陈浮), Yanping SONG (宋彦萍). A saw-tooth plasma actuator for film cooling efficiency enhancement of a shaped hole[J]. Plasma Science and Technology, 2017, 19(8): 85505-085505. DOI: 10.1088/2058-6272/aa6744
    [3]Zhigang ZHU (朱志刚), Qiyong ZHANG (张启勇), Yuntao SONG (宋云涛), Ming ZHUANG (庄明), Zhiwei ZHOU (周芷伟), Anyi CHENG (成安义), Ping ZHU (朱平). Present status and one upgrading method with a cold compressor of the EAST sub-cooling helium cryogenic system[J]. Plasma Science and Technology, 2017, 19(5): 55603-055603. DOI: 10.1088/2058-6272/aa58da
    [4]LI Guozhan(李国占), CHEN Fu(陈浮), LI Linxi(李林熙), SONG Yanping(宋彦萍). Large Eddy Simulation of the E?ects of Plasma Actuation Strength on Film Cooling Efficiency[J]. Plasma Science and Technology, 2016, 18(11): 1101-1109. DOI: 10.1088/1009-0630/18/11/08
    [5]TANG Enling (唐恩凌), WU Jin (吴尽), WANG Meng (王猛), ZHANG Lijiao (张立佼), XIANG Shenghai (相升海), XIA Jin (夏瑾), LIU Shuhua (刘淑华), HE Liping (贺丽萍), HAN Yafei (韩雅菲), XU Mingyang (徐名扬), ZHANG Shuang (张爽), YUAN Jianfei (袁健飞). Damage Characteristics of the Logical Chip Module Due to Plasma Created by Hypervelocity Impacts[J]. Plasma Science and Technology, 2016, 18(4): 412-416. DOI: 10.1088/1009-0630/18/4/14
    [6]ZHANG Jingyang (张镜洋), HAN Le (韩乐), CHANG Haiping (常海萍), LIU Nan (刘楠), XU Tiejun (许铁军). The Corrected Simulation Method of Critical Heat Flux Prediction for Water-Cooled Divertor Based on Euler Homogeneous Model[J]. Plasma Science and Technology, 2016, 18(2): 190-196. DOI: 10.1088/1009-0630/18/2/16
    [7]LI Sen(李森), SONG Zhiquan(宋执权), ZHANG Ming(张明), XU Liuwei(许留伟), LI Jinchao(李金超), FU Peng(傅鹏), WANG Min(王敏), DONG Lin(董琳). Finite Element Method Applied to Fuse Protection Design[J]. Plasma Science and Technology, 2014, 16(3): 294-299. DOI: 10.1088/1009-0630/16/3/22
    [8]XU Yan (许妍), LIU Guangzhou(刘广洲), WU Yaorui(吴姚睿), ZHU Mingfeng(朱明枫), YU Zi(喻孜), WANG Hongyan(王红岩), ZHAO Enguang(赵恩广). The Effects of δ Meson on the Neutron Star Cooling[J]. Plasma Science and Technology, 2012, 14(5): 375-378. DOI: 10.1088/1009-0630/14/5/06
    [9]KANG Weishan(康伟山), CHEN Jiming(谌继明), WU Jihong(吴继红). Analysis and Optimization of Cooling Channels in ITER Blanket Module[J]. Plasma Science and Technology, 2010, 12(5): 628-631.
    [10]WANG Shenggao (王升高), WANG Mingyang (王明洋), Yu Dongdong (余冬冬), ZHANG Wenbo (张文波), DENG Xiaoqing (邓晓清), DU Yu (杜宇), CHENG Lili (程莉莉), WANG Jianhua (汪建华). Integrated carbon nanotubes electrodes in microfluidic chip via MWPCVD[J]. Plasma Science and Technology, 2010, 12(5): 556-560.

Catalog

    Article views (159) PDF downloads (1434) Cited by()

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return