Study on AlxNiy Alloys as Diffusion Barriers in Flexible Thin Film Solar Cells

YUE Hongyun; WU Aimin; QIN Fuwen; LI Tingju

Plasma Science and Technology > 2011 > 13(5): 600-603.

YUE Hongyun, WU Aimin, QIN Fuwen, LI Tingju. Study on AlxNiy Alloys as Diffusion Barriers in Flexible Thin Film Solar Cells[J]. Plasma Science and Technology, 2011, 13(5): 600-603.

Citation:

YUE Hongyun, WU Aimin, QIN Fuwen, LI Tingju. Study on AlxNiy Alloys as Diffusion Barriers in Flexible Thin Film Solar Cells[J]. Plasma Science and Technology, 2011, 13(5): 600-603.

Citation:

YUE Hongyun, WU Aimin, QIN Fuwen, LI Tingju. Study on AlxNiy Alloys as Diffusion Barriers in Flexible Thin Film Solar Cells[J]. Plasma Science and Technology, 2011, 13(5): 600-603.

PDF (244 KB)

Study on AlxNiy Alloys as Diffusion Barriers in Flexible Thin Film Solar Cells

1 School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China 2 Key Laboratory of Materials Modification, Ministry of Education, Dalian 116024, China

Funds: supported by the Fundamental Research Funds for the Central Universities (No. DUT10JN08)

More Information

Received Date: November 23, 2010

Graphical Abstract

Abstract

Abstract

Co-sputtered AlxNiy thin films were used as diffusion barriers between aluminum and hydrogenated microcrystalline silicon (μc-Si:H) for flexible thin film solar cells. The stoichiometric ratio of AlxNiy showed a significant effect on the structures of the films. The obtained Al3Ni2 film was amorphous, while polycrystalline films were obtained when the ratio of aluminum to nickel was 1:1 and 2:3. An auger electron spectroscope and four-point probe system were applied to test the resistance to the interdiffusion between aluminum and silicon, as well as the conductivities of the AlxNiy barriers. The data of auger depth profile showed that the content of silicon was the minimum in the aluminum layer after sputtering for 4 min using AlNi thin film as the barrier layer. Compared to other AlxNiy alloys, the AlNi thin film possessed the lowest sheet resistance.
- barrier,
- thin film,
- surface and interface,
- interdiffusion

FullText(HTML)

References (0)

[1]	B I MIN, D K DINH, D H LEE, T H KIM, S CHOI. Numerical modelling of a low power non-transferred arc plasma reactor for methane conversion[J]. Plasma Science and Technology, 2019, 21(6): 64005-064005. DOI: 10.1088/2058-6272/ab00ce
[2]	Hai XIE (谢海), Rui DING (丁锐), Junling CHEN (陈俊凌), Jizhong SUN (孙继忠). Modelling of carbon erosion and re-deposition for the EAST movable limiter[J]. Plasma Science and Technology, 2017, 19(4): 45603-045603. DOI: 10.1088/2058-6272/aa4ee0
[3]	Guozhong DENG (邓国忠), Xiaoju LIU (刘晓菊), Liang WANG (王亮), Shaocheng LIU (刘少承), Jichan XU (许吉禅), Wei FENG (冯威), Jianbin LIU (刘建斌), Huan LIU (刘欢), Xiang GAO (高翔). Modeling of divertor power footprint widths on EAST by SOLPS5.0/B2.5-Eirene[J]. Plasma Science and Technology, 2017, 19(4): 45101-045101. DOI: 10.1088/2058-6272/aa5802
[4]	GUO Bin (郭斌 ), SONG Zhiquan (宋执权 ), FU Peng (傅鹏 ), JIANG Li (蒋力 ), LI Jinchao (李金超), WANG Min (王敏), DONG Lin (董琳). Thermal Dissipation Modelling and Design of ITER PF Converter Alternating Current Busbar[J]. Plasma Science and Technology, 2016, 18(10): 1049-1054. DOI: 10.1088/1009-0630/18/10/14
[5]	HE Yuchen (何雨辰), Satoshi UEHARA, Hidemasa TAKANA, Hideya NISHIYAMA. Numerical Modelling and Simulation of Chemical Reactions in a Nano-Pulse Discharged Bubble for Water Treatment[J]. Plasma Science and Technology, 2016, 18(9): 924-932. DOI: 10.1088/1009-0630/18/9/09
[6]	CUI Xuewu (崔学武), PAN Yudong (潘宇东), CUI Zhengying (崔正英), LI Jiaxian (李佳鲜), et al.. HL-2M Divertor Geometry Exploration with SOLPS5.0[J]. Plasma Science and Technology, 2013, 15(12): 1184-1189. DOI: 10.1088/1009-0630/15/12/04
[7]	CUI Xuewu (崔学武), PAN Yudong (潘宇东), LI Jiaxian (李佳鲜), ZHANG Jinhua (张锦华), MAO Rui (毛瑞). Simulation Study for Divertor Geometry and Gas Puffng to Handle Huge Exhaust Power in HL-2M with SOLPS5.0[J]. Plasma Science and Technology, 2013, 15(6): 489-492. DOI: 10.1088/1009-0630/15/6/01
[8]	Shigetoshi NAKAMURA, Yusuke K. SHIBAMA, Kei MASAKI, Akira SAKASAI. Design Study of Top Lid with Clamp Structure in JT-60SA Cryostat[J]. Plasma Science and Technology, 2013, 15(2): 188-191. DOI: 10.1088/1009-0630/15/2/23
[9]	K. YAMAUCHI, K. SHIMADA, T. TERAKADO, M. MATSUKAWA, R. COLETTI, A. LAMPASI, E. GAIO, A. COLETT, L. NOVELLO. Detailed Analysis of the Transient Voltage in a JT-60SA PF Coil Circuit[J]. Plasma Science and Technology, 2013, 15(2): 148-151. DOI: 10.1088/1009-0630/15/2/14
[10]	Yoshitaka IKEDA, the JT-60SA Team. Present Status of JT-60SA Project and Development of Heating Systems for JT-60SA[J]. Plasma Science and Technology, 2011, 13(3): 367-375.